Hot bar reflow soldering is safe highly operator independent and easy to automate.
Hot bar soldering equipment.
Hot bar soldering is extremely effective in bonding components and parts that are dissimilar and difficult to unite.
Hot bar reflow soldering systems flex carriers and foil connectors mobile electronics such as telecommunications equipment as well as the electronics in motor vehicles require increasing packing density and thus arrangement of the circuits in multiple layers.
Hot bar reflow soldering is a selective soldering process in which two solder plated parts are pressed together and heated to a temperature adequate to cause the solder to melt and flow after which the parts are cooled to form a permanent electro mechanical bond.
Building 2 gang hua xing industrial park chongqing road fuyong.
The temperature of the stamp transfers the required heat into the joint to be soldered.
Supplier of soldering materials and production supplies.
Advanced integrated technologies inc ait is recognized throughout the world as a leading authority on hot bar soldering equipment including the manufacturing of hot bars and reflow soldering thermodes.
Several examples are listed above but there are many other soldering situations that call for manncorp s pbs hot bar reflow soldering system.
Acf heat seal bonding heat seal bonding also called acf bonding is the process of creating electrical conductive adhesive bonds between flexible and rigid circuit boards glass panel displays and flex foils with very fine pitch 30 micron.
Leading manufacturer of equipment and systems for resistance welding laser welding laser marking laser cutting laser micromachining and hot bar bonding.
Stellar technical products is a leading u s.
Advanced integrated technologies inc ait is recognized throughout the world as a leading authority on hot bar soldering equipment including the manufacturing of hot bars and reflow soldering thermodes.
Get the benefit of our 20 years of experience building hot bars thermodes for unitek hughes avio and many other bonding systems.